Saturday 6 August 2016

Tiny liquid metal for heat free soldering

                Scientists have developed micro-scale, liquid-metal particles that can be used for heat-free soldering and fabricating, repairing and processing of metals – all at room temperature. The project started as a search for a way to stop liquid metal from returning to a solid. This is called ‘undercooling’ and it has been widely studied for insights into metal structure and metal processing. Researchers from Iowa State University in the US thought if tiny droplets of liquid metal could be covered with a thin, uniform coating, they could form stable particles of undercooled liquid metal.

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